Photoresist Processing Trouble-Shooting Etchants and Solvents
Photoresists Ancillaries Storage/Handling/Ageing Substrate Pre-Treatment and Coating Baking Steps Exposure Development Coating and Lift-off Etching and Stripping
Mechanism Development Rate and Dark Erosion Impact of the Softbake Impact of the Exposure Dose
The development rate and dark erosion (= unexposed resist film thickness solved/development time) increases with increasing developer concentration in a different way. Therefore, using developer concentrates such as AZ® 400K or 351B, a correct dilution has to be applied with regard to the process requirements. A typical dilution ratio of these two developers mentioned is 1:3.5 .. 1:4 in H2O, allowing a reasonable high development rate with a high selectivity (ratio development rate/dark erosion).
Weiterführendes Dokument (pdf) Literature: Exposure and Development Weiterführendes Dokument (pdf) Introducing new Resists/Processes
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Photoresists (positive, negative, image reversal, thin and thick resists, spray resists, protective coating ...)
Ancillaries ( developers, thinner, adhesion promoter such as HMDS, remover)
Etchants (acids and the ready-to-use etching mixtures aluminium etch, chromium etch, gold etch und silicon etch)
Solvents (acetone, isopropyl alcohol, MEK ... in VLSI and ULSI quality)