Photoresist Processing Trouble-Shooting Etchants and Solvents
Photoresists Ancillaries Storage/Handling/Ageing Substrate Pre-Treatment and Coating Baking Steps Exposure Development Coating and Lift-off Etching and Stripping
Substrate Pre-Treatment Spincoating Spraycoating Dip Coating
Dip coating is a useful coating technique for large or rectangular substrates such as stainless steel panels. Hereby, the substrate immersed into a tank containing photoresist is slowly (few mm/s) pulled out of the tank.

During dip coating, the solvent composition is an important parameter for a homogeneous resist film thickness: Solvent fractions with a high vapour pressure make the resist film rapidly sticky enough in order not to flow back into the tank immediately after the substrate leaves the resist volume. Solvent fractions with a low vapour pressure give the the resist film enough time to smoothen. The photoresist film thickness homogeneity attainable by dip coating is not comparable to the spin-coating technique, but more than sufficient for many processes such as stainless steel etching with FeCl3.

Please contact us if we can be of assistance with our dip coating resists and related know-how for starting or improving your dip-coating process!
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MicroChemicals® - All you need for microstructuring with short lead times also in small sales volumes:

Photoresists (positive, negative, image reversal, thin and thick resists, spray resists, protective coating ...)
Ancillaries ( developers, thinner, adhesion promoter such as HMDS, remover)
Etchants (acids and the ready-to-use etching mixtures aluminium etch, chromium etch, gold etch und silicon etch)
Solvents (acetone, isopropyl alcohol, MEK ... in VLSI and ULSI quality)