Photoresist Processing Trouble-Shooting Etchants and Solvents
Photoresists Ancillaries Storage/Handling/Ageing Substrate Pre-Treatment and Coating Baking Steps Exposure Development Coating and Lift-off Etching and Stripping
Positive/Negative/Image Reversal Chemical Stability Thermal Stability Optical Properties Solvent The Resin The Photo Active Compound
Positive photoresists develop at the exposed areas, while the unexposed resist remains on the substrate after development. MicroChemicals® supplies positive resists suited for almost all lithographic applications such as dry etching, wet etching, electroplating, metallization with a lateral resolution starting from 350 nm on, and a resist film thickness range from few 100 nm towards 100 μm and more: The 1500-series of "thin" resists with improved adhesion (AZ® 1505, 1512HS, 1514H and 1518), the 6600-series with its improved thermal stability (AZ® 6612, 6624 and 6632), the high-resolution AZ® 701MiR and ECI 3027, and the thick resists AZ® 4562 and AZ® 9260.

Negative photoresists behave opposite: The areas exposed crosslink during a subsequent baking step (post exposure bake, PEB) and remain after development. With the aqueous developable and organic removable AZ® nLOF 2000 family of negative resists, MicroChemicals® covers a thickness range from 1 .. 20 μm (AZ® nLOF 2020, 2035, and 2070.

Image reversal resists can either be processed positive or negative. If the latter is required, an image reversal bake followed by a flood exposure makes the areas exposed in the first step inert in developer. MicroChemicals® supplies image reversal resists such as AZ® 5214E, TI 35ES, and TI xLift for a resist thickness range from approx. 1 to 20 micron.

Beside original sales volumes, MicroChemicals® also supplies small (250 ml, 500 ml, 1.000 ml) sales volumes of all resists mentioned above with short lead times.
Weiterführendes Dokument (pdf) Product Overview (Resists and Developers) e-Mail Anfrage Request: Consultation for suited resists/developers  Post Exposure Bake  Image Reversal Bake Weiterführendes Dokument (pdf) Process startup
MicroChemicals® - All you need for microstructuring with short lead times also in small sales volumes:

Photoresists (positive, negative, image reversal, thin and thick resists, spray resists, protective coating ...)
Ancillaries ( developers, thinner, adhesion promoter such as HMDS, remover)
Etchants (acids and the ready-to-use etching mixtures aluminium etch, chromium etch, gold etch und silicon etch)
Solvents (acetone, isopropyl alcohol, MEK ... in VLSI and ULSI quality)